Can somebody explain the team thermal runaway and how can this be controlled?
Answer:
Very simply put, thermal runaway means that there's a condition where more heat will generate even *more* heat.
This can occur in the land of electronics, too, with transistors in particular.
For example, the resistance of a power MOSFET in its "on" state increases with temperature. With that resistance increase, the power dissipated for a constant on-current increases, the junction temperature increases, and the resistance further increases ... well, you get the idea. The control for this is to do better at creating a heat sink for the MOSFET so that it doesn't overheat and get into this downward spiral.
Most thermal runaway conditions, no matter what the materials or devices involved, occur because heat generated by the material, process or device just wasn't adequately controlled. Any design where this is possible needs to take into account possible fault conditions that will generate unusual amounts of heat and incorporate those conditions into planning for heat generation and dissipation.
In an exothermic reaction, the heat produced by the reaction increases the rate of the reaction. This normally results in what we call an 'explosion'. ;-)
To control it you have to remove heat faster than it's being produced, or remove one or more of the reactants.
See the wiki page below for more details:
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